Rsuwei

On Wafer System

wafer temperature measurement 晶圆测温

On Wafer System

  • Wafer size: 8″, 12″
  • Temperature precision: ±0.1℃-0.2℃
  • Temperature measure range: 15-100℃
  • Number of measurement point: 1~81

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Product Introduction

On Wafer System – Actual Monitoring Wafer Temperature On Dry Etch Process

The Wireless On-Wafer Temperature Measurement System is a complete measurement system embedded in a wafer that can measure and record the impact of the dry etch process environment on production wafers under actual process conditions, without the need for wired connections. The on wafer system can actually monitoring wafer temperature on dry etch process, designed to calibrate, improve uniformity and match temperature profiles.

By measuring temperature data at conditions close to the product process, the On-Wafer wireless temperature measurement system can help process engineers adjust etch process conditions, verify and match chambers, and validate after PM. 

Specifications

Item No.ItemData
1Wafer size8”,12”
2Wafer materialSilicon
3Surface materialSilicon
4Number of measurement point81/65
5Sensor typeIC
6Temperature test rangeDry Etch: 15-100℃  
Wet Clean: 15-120℃
7Manufacturing tool temperature test rangeDry Etch: 12-85℃
Wet Clean: 15-120℃
8Precision0.1℃/0.2℃
9Thickness1.2mm
10ConnectionRF
11Power battery
12Charge bluetooth
13Sampling frequency1Hz/2Hz/4Hz
14ApplicationWet clean, Dry Etch

Software demostration Interface

Applications

Wet clean
Dry Etch

Customization

ON WAFER MAP


1. Determine the temperature accuracy requirements and dimensions.

2. Determine the usage environment and whether it meets the requirements (currently, 8-inch wireless temperature measurement wafers can be used in plasma and ESC environments).

3. Determine the number and arrangement of points.