Auto Vibration and Leveling System For Wafer Handling
Auto Vibration and Leveling System For Wafer Handling
- Measurement type: X/Y/Z acceleration;X/Y leveling data;RMS
- Base material: Silicon/carbon fiber
- Sampling frequency: Standard 100Hz /customized 200-500Hz
- For wafer size: 200mm, 300mm
- Cost efficient, improve conformity during wafer tranfer
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Auto Vibration and Leveling System For Wafer Handling
Product Introduction
The auto vibration and leveling system For wafer handling
system can monitor the vibration status of equipment in real-time, ensuring that the equipment operates in optimal conditions and reducing the impact of vibration on the production process. It can automatically detect the level status of the equipment, ensuring that it maintains the correct positioning throughout the processing, thereby enhancing the consistency and precision of the process. It is applied to wafer carriers, FOUPs, wafer automation handling robots, wafer calibration equipment, load locks, wafer pins, process chamber bases, overhead handling systems, and wafer loading and inspection integrated devices (SMIF).
Applications
Measurement of:
Wafer casette
FOUPs
Wafer automation handling robots
Wafer calibration equipment
Load locks
Wafer pins
Process chamber pedestrals
Technical Data Sheet
| Item | Data | |
| Measurement type | X/Y/Z acceleration; X/Y leveling data; RMS; | |
| Base material | Silicon/carbon fiber | |
| Sampling frequency | Standard 100Hz /customized 200-500Hz | |
| Measurement range | Leveling | X,Y ±90°(Precision± 0.03° ) |
| Acceleration | X,Y,Y ±4g （Precision±0.005g） | |
| RMS | X,Y,Y ±4g （Precision±0.005g） | |
| Connection type | bluetooth | |
| Size | 200mm、300mm (8”、12”) | |
| Weight | 145g（8”）、181g（12”） | |
| Thickness | Central area：6.6mm；edge：0.65mm ；customized: 3.5mm | |
| AVLS software | Real-time data interface of X/Y leveling data, X/Y/Z acceleration, vibration and RMS | |
| Data analyzer | AVLS configured computer | |