ATS Wafer - Auto Teaching System
ATS Auto-Teaching System
- Wafer Size: 8″, 12″
- With image capturing camera
- Capture offset Data X, Y
- Focal Length 12mm-45mm
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ATS Wafer – Auto Teaching System
Product Introduction
The ATS Wafer is a special processing technology that combines a circuit board with image capturing capabilities with a carbon fiber chassis, which can be used to locate objects by capturing images of their location and obtain offset data (X, Y) to quickly calibrate wafer transfer positions.
Wafer transfer measurement is performed by ATS Wafer at locations such as the robot, and the deviation from the center point of the hot plate, etc. is measured after the transfer is completed. It is generally used for equipment debugging after the equipment is installed.
Benefits of ATS wafer
Capture Offset Data:
The Automated Test System (ATS) that handles the semiconductor wafers likely experiences small positional variations as the wafers move through the manufacturing equipment. Capturing offset data on the actual positions of the wafers compared to the expected positions is important.
Accurate Calibration:
Using the offset data captured, the ATS system can be calibrated to adjust for these positional variations. This ensures the wafers are accurately transferred to the right positions throughout the manufacturing process.
Improve Yield:
With the ATS system properly calibrated, the semiconductor manufacturing process can be optimized. This helps minimize defects and improve the overall yield of good chips produced.
Specifications
No. | Item | Specification |
1 | Wafer size | 8”，12” |
2 | Base material | Carbon fiber composite |
3 | Tolerance | ±0.1mm（X、Y） |
4 | Measurement dimension | X、Y |
5 | Focal length | 12mm-45mm |
6 | Housing material | Carbon fiber composite |
7 | Weight | 160g-240g |
8 | Operating temperature range | 20-50℃ |
9 | Thickness | 6.75mm |
10 | Connection type | Bluetooth 2.4GHz |
11 | Working vacuum value | <10-6torr – 760torr |
12 | Usage time per charge | > 2 hrs |
Software demostration Interface
Applications
Applied to all robot transfer-related equipment, such as fully automatic coating and developing, fully automatic etching, and fully automatic annealing furnace.
When the robot transfers ATS in the machine, the ATS Wafer receives real-time data through the cloud map user interface to display the X, Y offset data indicators, shortens the machine debugging time, and quickly and accurately corrects the wafer transfer position.
Lead Time
40 days