AGS Wafer
Product Introduction
For semiconductor processes such as thin film deposition, sputtering and etching, AGS improves consistency and process yield by achieving precise and repeatable settings, enabling fast non-contact gap measurement and parallelism adjustment in vacuum, improving consistency, tool utilization and repeatability.
Applications
Thin film deposition
Sputtering
Etching
Product Stage
Under development
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FAQ
Yes. Define each length of L1, L2, L3 ( Mainly consider the length that TC-wafer placed in the chamber)
Yes. We provide flexible customization service to meet our client’s needs.
Not really the same. The temperature in process should be consider when choosing the correct item. For example, TC-wafer can test within 1200℃, but On Wafer system can only test under 100℃.
