Auto Vibration System
Auto Vibration System (AVS) For Wafer Transfer Test
- Measurement type: X/Y/Z accelerated speed、RMS
- Material: silicon/carbon fiber
- Thickness: Central: 6.6mm；edge：0.65mm ；Customized: 3.5mm
- Connection type: bluetooth
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Auto Vibration System (AVS) For Wafer Transfer Test
Product Introduction
Utilizing the auto vibration system(AVS) to observe and optimize the movement of wafers, wafer transport boxes, the SMIF integrated device for wafer loading and inspection, and the FOUP wafer boxes. Through the AVS real-time detection system suitable for vacuum environments, it enables the monitoring of wafer sliding, slippage, collisions, scratches, and rough handling without interrupting the machine’s operational state.
Applications
Measurement of:
Wafer casette
FOUPs
Wafer automation handling robots
Wafer calibration equipment
Load locks
Wafer pins
Process chamber pedestrals
Technical Data Sheet
| Item | Data | |
| Measurement type | X/Y/Z accelerated speed、RMS | |
| Material | silicon/carbon fiber | |
| Sampling frequency | Standard 100Hz /Customized 200-500Hz | |
| Measurement range | Accelerated speed | X,Y,Y ±4g （Precision±0.005g） |
| RMS | X,Y,Y ±4g （Precision±0.005g） | |
| Connection type | bluetooth | |
| Size | 200mm、300mm (8”、12”) | |
| Weight | 145g（8”）、181g（12”） | |
| Thickness | Central: 6.6mm；edge：0.65mm ；Customized: 3.5mm | |
| AVS software | Real-time data interface of accelerated speed and RMS | |
| Data analyzer computer | Included | |